Ball Grid Array Baller
Reduce the Cost of Device Packaging With QTA machine's New Ball Grid Array Baller
Frustrated with the high cost of BGA rework? QTA Machine now offers an in-house solution. With their new Ball Grid Array Baller reworking device packages are easier and more economical than ever.
The balling system's precision adjustment mechanisms are designed to package devices with extraordinary precision.
Versatile and Efficient Packaging
QTA Machine's balling system comes with a customizable tooling set able to accomodate up to 16 different BGA/uBGA patterns. Competing systems initially accomodate a single package style and require the purchase of additional, expensive stages. In addition, QTA's system allows the operator to do up to 16 packages at a time, greatly increasing production efficiency.
Convenient and Easy to Use
The BGA Baller's innovative features were designed with convenience and ease of use in mind.
Doubles as a Two-Sided Screen Printer
Increased utilization for small surface mount assembly processes and lower tooling cost by putting both sides in one stencil
The Baller's stainless steel, black anodized aluminum and nickel plated components are durable, resistant to corrosion, and easy to clean and maintain.